MTS Packaging Engineer Job Listing at AMD in 新竹市 (Job ID 97435-en-us)

Description

ADVANCE YOUR CAREER. ADVANCE THE WORLD. 

At AMD, we believe technology has the power to solve the world's most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. 

Whether you're designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we'll advance your career.

THE ROLE:

We are seeking a highly skilled and motivated Package Engineer to lead NPI‑to‑HVM transitions and drive end‑to‑end DFM integration between the advanced package technology team and external manufacturing sites, ensuring manufacturable designs, stable ramp‑up, and high‑volume production readiness and sustaining across a complex external manufacturing ecosystem.

In this role, you will be responsible for IC package industrialization and high-volume manufacturing readiness for AMD product portfolios. You will partner with package design, substrate engineering, product engineering, reliability, test, quality, supply chain, and program management to enable stable, scalable processes, deliver seamless NPI-to-HVM transfers, and drive yield, quality, and delivery performance across multiple external manufacturing sites.

The ideal candidate combines advanced packaging process expertise with strong manufacturing and operations acumen and excels at cross-functional integration and supplier enablement. Applying DFM, DOE, SPC, FMEA, 8D, and Lean/Six Sigma, you will establish robust Processes of Record (POR), mitigate manufacturing risks, and accelerate ramp readiness for next-generation computing platforms, from enterprise server and client products to high-power AI accelerators.

THE PERSON & KEY RESPONSIBILITIES:

NPI to HVM Industrialization, Manufacturing Operations, and Sustaining

• Lead end-to-end NPI-to-HVM industrialization of advanced packages across external OSAT and foundry partners, ensuring design, process, equipment, and quality readiness before ramp.
• Coordinate ramp plans, risk mitigation, and readiness reviews to ensure stable yield and predictable scale-up.
• Support ongoing manufacturing and operations, and lead sustaining engineering to maintain stable yield, quality, and delivery in high-volume production.

Design for Manufacturing (DFM) Integration

• Serve as the primary interface between package design, technology development, and external partners to ensure manufacturable package architectures.
• Drive end-to-end DFM integration, identifying and closing manufacturability and technology-to-manufacturing gaps early.
• Advance manufacturing methodologies and best practices across the supply chain.

External Supplier Manufacturing Management

• Partner with OSATs, foundries, and substrate suppliers to ensure capability, capacity, and process maturity.
• Monitor and drive yield, cycle time, quality, and delivery performance across external sites.
• Lead supplier process optimization and defect reduction through regular technical reviews, audits, and ramp readiness assessments.

Yield, Quality, and Process Control

• Drive continuous improvement using DOE, SPC, FMEA, and data-driven root cause analysis.
• Lead cross-functional investigations of yield excursions, reliability risks, and field quality issues, ensuring timely containment and corrective action (8D).
• Develop process monitoring and early-detection frameworks aligned with corporate quality, reliability, and qualification standards.

Cross-Functional Program Execution

• Collaborate with product development, design, technology, reliability, product, test, supply chain, and program teams to ensure aligned execution.
• Drive readiness reviews, risk assessments, and ramp governance across product lines.
• Support cost, schedule, capacity, and production targets for Enterprise, Client, and AI accelerator products.

PREFERRED EXPERIENCE:

1. Years in semiconductor packaging, assembly manufacturing, or product engineering, preferably in high-volume manufacturing.
2. Proven record driving NPI and manufacturing ramps, including process qualification, manufacturing readiness, and yield ramp monitoring for advanced packaging platforms.
3. Experience with OSATs, foundries, and substrate suppliers in ramp enablement, yield improvement, and manufacturing readiness, including leading technical reviews and issue resolution.
4. Demonstrated success in yield improvement, defect reduction, and process optimization in high-volume manufacturing.
5. Solid background in advanced packaging, including 2.5D interposer (e.g., CoWoS), wafer-level fan-out (WLFO), and high-density flip-chip, with familiarity in RDL and TCB processes.
6. Solid understanding of Design for Manufacturing (DFM) principles for package design and assembly.
7. Proven problem solving and root cause analysis using DOE, SPC, FMEA, and 8D, with strong data-driven decision making to improve yield, quality, and processes.
8. Proven cross-functional collaboration with package design, product engineering, reliability, quality, test, supply chain, and program management teams.
9. Excellent communication and stakeholder management, translating complex engineering challenges into clear action plans for internal teams and suppliers.
10. Fluent in English and Mandarin with strong written and verbal communication skills; Korean language capability is a plus.

ACADEMIC CREDENTIALS:

• Bachelor's or master's degree in mechanical engineering, Materials Science, Electrical Engineering, Chemical Engineering, or a related engineering discipline.

LOCATION:

Hsinchu, Taiwan

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Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD's “Responsible AI Policy” is available here.

This posting is for an existing vacancy.