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Company: AMD
Location: Austin, TX
Career Level: Mid-Senior Level
Industries: Technology, Software, IT, Electronics

Description



WHAT YOU DO AT AMD CHANGES EVERYTHING 

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.  Together, we advance your career.  



 

THE ROLE:

Join a global product reliability team that drives silicon and package qualifications to develop the next generation artificial intelligence (AI) capabilities within a single package, leveraging advanced silicon and packaging technologies. This position is a highly visible role within the AMD engineering team and is responsible for defining and executing reliability qualifications for new products to align with AMD product and customer requirements. The engineer will possess technical authority in a fast-paced, dynamic environment that requires decision making at strategic and tactical levels. The position provides influence that mandates strong analytical and technical skills. This role works closely with AMD engineering teams and communicates regularly with foundries and customers to determine the reliability requirements of current and future products.

 

THE PERSON:

  • Demonstrated success working in product Quality and Reliability, with strong familiarity of Semiconductor IC Product Development, Silicon Fab process, Package Reliability, high volume manufacturing, external supplier and customer interactions, and project management.
  • A self-motivated, team player who focuses on collaboration, team building, and expanding team success.
  • Technical expertise in either the area of advanced 3D packaging or leading-edge silicon fab process is strongly preferred.

 

RESPONSIBILITIES:

  • Starting at early product development stages, establish comprehensive silicon and package qualification plans for early reliability assessment studies and final product qualification testing.
  • Take on leadership of planning and execution of reliability activities throughout development, qualification, production-ramp, and sustaining.
  • Communicate with offshore factories and reliability labs during reliability test qualification.
  • Coordinate debug and analysis of reliability observations, drive root cause and corrective actions working in collaboration with engineering teams and Foundry partners.
  • Perform reliability modeling estimations across varying usage and operating life conditions; model product lifetime conditions using Weibull Modeling.
  • Work with Foundry partners to align AMD product qualification requirements and technical risk assessments to ensure the foundry technology reliability envelope aligns with AMD design and IP portfolio.

 

PREFERRED EXPERIENCE:

  • Strong communication skills including data presentation.
  • Knowledge of industry standard stress test methodologies (JEDEC, AEC).
  • Semiconductor fabrication and device physics knowledge.
  • Understanding of Package assembly processes, 3D-stacking package reliability.
  • Understanding of Intrinsic and Extrinsic silicon reliability mechanisms, their process interactions and acceleration models.
  • Experience with Silicon Failure Analysis methods and interpreting results.
  • Proficiency using statistical analysis software with reliability model experience.
  • Demonstrated ability of use of modeling techniques to estimate intrinsic and extrinsic lifetimes, determine burn-in conditions, device degradation models for production guard bands, and generate lifetime projections.
  • Experience with high-bandwidth memory (HBM) is desired.
  • Knowledge of Silicon Photonics reliability, a plus.

 

ACADEMIC CREDENTIALS:

  • BS/MS or PhD in Electrical Engineering, Physics, Materials Science, or equivalent.

 

This role is not eligible for visa sponsorship.

 

#LI-HYBRID

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Benefits offered are described:  AMD benefits at a glance.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.

 

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD's “Responsible AI Policy” is available here.

 

This posting is for an existing vacancy.


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