Description
WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.
THE ROLE:
We are seeking a senior-level manufacturing technology expert to drive advanced SMT and board assembly process development for advanced computing platforms. This is a technology development role responsible for defining assembly strategies, influencing product design, and enabling manufacturability for high-complexity PCB assemblies—particularly large BGA packages with significant warpage and coplanarity challenges.
You will work at the intersection of package engineering, PCB design, mechanical and thermal integration, reliability, and global manufacturing, setting standards and best practices deployed across multiple manufacturing partners worldwide.
THE PERSON:
- Establishes robust, high-yield SMT assembly processes for thermally and mechanically demanding PCB assemblies
- Translates warpage, coplanarity, and thermal behavior into manufacturable design rules and process windows
- Develops scalable guidelines, BKMs, and training across internal teams and EMS partners
- Solves non-conventional assembly challenges that exceed standard SMT capability
KEY RESPONSIBILITIES:
- Advanced SMT Process Development
- Lead end-to-end SMT process development, for Printing / stencil, Placement, Reflow, Post-reflow process
- Define robust process windows balancing yield, reliability, and scalability
- Drive structured experimentation (DOE) to resolve complex yield issues
- Develop and validate assembly flows for manufacturing readiness
- Serve as technical owner for assembly of large, mechanically challenging BGA packages and complex board constructions.
- Develop measurement and correlation methodologies for warpage/coplanarity across room temperature, reflow, and post-assembly conditions.
- Translate empirical data into actionable controls: stencil strategy, placement approach, reflow profile optimization, and board support concepts.
- Define practical coplanarity and interface-gap limits based on real manufacturing capability.
- Define stencil design guidelines for mixed-technology assemblies (thickness selection, aperture optimization, via-in-pad approaches, paste volume control).
- Drive strategies to reduce defects including insufficient solder, head-in-pillow, bridging, and voiding.
- Collaborate with suppliers to evaluate solder paste materials, flux systems, and stencil fabrication technologies.
- Define placement process requirements for challenging components: placement force/speed, nozzle and vacuum strategy, and fixturing/support concepts.
- Develop fixture and board support concepts for large packages
- Work directly with equipment vendors and manufacturing partners to qualify placement capability and drive tool enhancements when required.
- Drive reflow strategies for assemblies with high thermal mass and uneven heat distribution.
- Develop profiling methodologies to control thermal gradients across boards and complex component populations.
- Lead evaluation and deployment of advanced reflow technologies (e.g., vacuum and inert-atmosphere reflow) to improve solder joint integrity and void performance.
- Define requirements for custom or modified equipment when standard solutions are insufficient.
- Define and qualify edge bonding and underfill strategies to improve mechanical shock, vibration, and board-level reliability.
- Develop manufacturable processes for mechanical and thermal hardware integration (heatsinks, clamping, thermal interface materials).
- Evaluate mechanical stress transfer to solder joints and ensure processes are repeatable and auditable.
BGA Rework and Repair Strategy- Develop controlled rework methodologies for complex BGA assemblies, including safe removal/replacement processes.
- Ensure reworked assemblies meet full quality and reliability requirements through defined acceptance criteria and verification methods.
- Lead DFM reviews for advanced PCB designs: land patterns, via-in-pad structures, solder mask strategy, component keep-outs, and routing considerations.
- Provide clear, data-driven feedback to influence design decisions early in development.
- Author and maintain board-level assembly design guidelines for internal teams and external manufacturing partners.
- Act as a technical bridge across design engineering, reliability, mechanical/thermal, quality, and global manufacturing teams.
- Drive technical engagements with contract manufacturers, material suppliers, and equipment vendors.
- Drive root-cause analysis and corrective actions for complex yield and reliability issues using engineering rigor and data.
- Drive development of advanced solutions:
- Micro spring / spacer technologies
- Copper spacer block tolerancing
- Low-temperature solder (LTS) evaluation
- Vacuum reflow process integration
- Removable lid concepts for warpage mitigation
- Define and execute DOE frameworks for new technologies
PREFERRED EXPERIENCE:
- Extensive hands-on SMT process development experience for high-complexity PCB assemblies.
- Demonstrated ownership of large BGA assembly challenges, including warpage, coplanarity, thermal behavior during reflow, and post-assembly stability.
- Proven track record of developing processes that transition successfully from engineering builds to high-volume manufacturing.
- Experience working directly with global manufacturing partners and equipment vendors to qualify capability and drive improvements.
- Strong background in structured problem solving (DOE, statistics, root-cause analysis) for yield and reliability issues.
- Experience with advanced reflow capabilities (vacuum/inert atmosphere) and void reduction strategies.
- Experience developing board-level mechanical robustness processes (edge bond/underfill) for demanding environments.
- Experience defining and implementing rework strategies for complex assemblies while maintaining reliability requirements.
- Experience with large BGA (>70mm) and high warpage (>400–500 µm class)
ACADEMIC CREDENTIALS:
- Bachelor's or Master's degree with significant experience in manufacture Engineering, Mechanical Engineering, Materials Science, or a related discipline
LOCATION:
San Jose, CA
This role is not eligible for visa sponsorship.
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Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
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